Brief: Here’s a fast, informative look at what this solution does and how it behaves. This video showcases the Big Size 10-20mm Heat Sink Poly CVD Diamond Plate, demonstrating its exceptional thermal management capabilities and corrosion resistance in demanding applications. You'll see how its unique properties make it an ideal optical and thermal material.
Related Product Features:
Offers exceptional thermal conductivity ranging from 1000-1200 W/mK for efficient heat dissipation.
Provides high corrosion resistance against most acids and alkalis for long-lasting performance.
Features superior hardness rated 10 on Mohs scale for excellent wear and abrasion resistance.
Maintains thermal stability up to 800°C in demanding operational environments.
Exhibits broadband optical transparency from ultraviolet to far infrared spectrum.
Manufactured using Chemical Vapor Deposition (CVD) method for consistent quality.
Available in light brown and brown appearances with biocompatible, non-toxic properties.
Designed as an electrical insulator while providing outstanding thermal management capabilities.
FAQs:
What is the thermal conductivity range of this CVD diamond plate?
The Big Size 10-20mm Heat Sink Poly CVD Diamond Plate offers exceptional thermal conductivity ranging from 1000-1200 W/mK, making it highly effective for heat dissipation applications.
How does this material perform in corrosive environments?
This polycrystalline diamond plate is highly resistant to corrosion, demonstrating excellent chemical stability against most acids and alkalis, ensuring long-term durability in harsh conditions.
What temperature range can this heat sink material withstand?
The material maintains thermal stability up to 800°C, making it suitable for high-temperature applications where reliable thermal management is critical.
Is this CVD diamond plate electrically conductive?
No, this polycrystalline diamond plate functions as an electrical insulator while providing outstanding thermal conductivity, making it ideal for applications requiring thermal management without electrical conduction.