Brief: Discover the CVD Diamond Wire Drawing Dies with (111) Crystal Orientation, the ultimate solution for precision wire manufacturing. These dies offer 3x longer life for tungsten and gold wire production, featuring exceptional mechanical properties and flawless monocrystalline structure.
Related Product Features:
Exceptional mechanical properties with Young's Modulus of 1150-1300 GPa and microhardness of 80-150 GPa.
Flawless monocrystalline structure with inclusion/dislocation-free design and wear rate variation under 5%.
Unrivaled durability with fracture strength over 8 GPa and 5,000km crack-free operation for φ0.03mm Cu wire.
Atomic-level precision with (111) orientation accuracy under 0.5° and bore tolerance of ±0.05mm.
Crystal orientation engineering maximizes shear strength, making it 3x more wear-resistant than PCD dies.
Defect-free reliability eliminates intergranular fracture risks found in polycrystalline materials.
Nano-scale precision with laser-machined bore surface (Ra<0.1μm) reduces wire surface scratches by 95%.
সাধারণ জিজ্ঞাস্য:
What makes the CVD Diamond Wire Drawing Dies more durable than PCD dies?
The (111) crystal orientation and monocrystalline structure provide 3x more wear resistance and eliminate intergranular fracture risks, resulting in 92% lower cracking rates compared to PCD dies.
How does the thermal management of these dies work?
With a thermal conductivity of 2000 W/m*K, the dies prevent localized overheating, ensuring stable performance even at high temperatures, with less than 0.002% deformation at 1200℃.
What types of wires are these dies suitable for?
These dies are ideal for ultra-fine refractory wires, stainless steel wire, precious metal processing, high-performance alloys, and semiconductor bonding wires.